【Intel 成都实习】Failure Analysis Intern

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【Intel 成都实习】Failure Analysis Intern

Location: Chengdu
Contact: haomei.tang@intel.com

To be an intern in failure analysis (FA) group, you will have the opportunity to closely touch most advanced semiconductor FA tools and techniques in the world. As a part of FA team, you will actively engage in failure analysis support in component (CPU and PCH) and silicon wafer/die and improving product yield, quality and/or reliability. You could not only know FA magic in revealing and fixing the failure/issues, but also the product manufacturing process & materials. In this role, you could work in the big labs, learn and operate multiple advanced tools and directly get involved in evaluating the electrical, mechanical and material characteristics of products to determine the root cause (RC) of failure and build RC hypothesis and design the experiment for RC model validation, etc. Work with experts from various group/departments to resolve complex technical challenges/issues.

Requirements:
- Prefer BS or MS degree of Engineering major, eg. Electronic Engineering, Material Science, Mechanical engineering, Physics, etc.
- Good English communication skill on both oral English and writing.
- Demonstration of good communication and presentation skills.
- Be able to deep dive into technical challenges, clear logic thinking and good at problem solving.
- Ability to work in a team environment.
- Require to work more than 3days/week and prefer longer than 3 months intern duration.

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