【Intel 成都实习】Die Preparation Intern

intelbbs

【Intel 成都实习】Die Preparation Intern

Location: Chengdu
Contact: haomei.tang@intel.com

Job responsibility:
Working in CD Die-Pre(DP) engineering group of Intel, one of the top semi companies in the world, as an intern will provide you a great opportunity to learn the most advance semiconductor knowledge in the best working environment. As a member of DP engineering team, you would be engaged in the semiconductor devices backend manufacture process and the team will bring a wonderful journey for you on how silicon magically turns to individual chips as well-known CPU appearance. Besides, we will help you with the daily work and the projects of equipment/process, Thinning, Laser, Saw, Pick & Place modules, improvement, which can lead you to make efforts, learn knowledges and innovation ideas and grow together with DP family.  Working with complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results.

Qualification:
1.Candidate should hold Bachelor or Master degree majoring in Mechanics, Mechatronics, Automation, Electronic, Laser/Optical, Material Science, etc.
2.Good English communication skill on oral English and writing. English as first language in daily work.
3.Having basic skill on Module Based Problem Solving, logic thinking and commonality data analysis.
4.Prefer the candidate could work 3+ days/week (8hours/day) and continue to work 3 months at least.

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