【Intel 成都校招】Package Failure Analysis Engineer

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【Intel 成都校招】Package Failure Analysis Engineer

工作地点：Chengdu
请发送简历到： staffing.chengdu@intel.com

Job Description:
Responsible for identifying and researching the failures of silicon wafer, bare die and components to improve product yield, quality and/or reliability. Evaluates the mechanical, material and electrical characteristics of integrated circuits, components, sub-components and systems, build RC hypothesis, design validation DOE to determine the root cause of failure and failure mechanism. Analyzes failure reports and recommends corrective action to prevent reoccurrence of problems. Work in the big labs, learn and operate various advanced tools such as Parametric Analyzer, polisher, optical microscope, Scanning Electron Microscope, etc., to perform fault Isolation and failure Analysis. You are part of new product transfer/startup and engage in development of new failure analysis method/process. Strives to proliferate shared learning across sites and work closely with experts from various groups/countries to resolve complex technical challenges/issues. Maintain necessary records and reports. Performs other related duties as required or as directed.

Qualification:
Bachelor degree or above in Electronics or Electrical Engineering, Material Science, Physics, Mechanical, Chemicals or related.
Proficient oral and written English.
Be able to deep dive into technical challenges, clear logic thinking and good at problem solving.
Self-motivated, good communication skills and team spirit.
Strong knowledge background and rich working experience in semiconductor, assembly and test industry is a plus

申请方式： 直接发送最新简历至 staffing.chengdu@intel.com, 邮件主题“姓名+申请职位”。

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